Heat dissipation device
US7174952B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2005 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Oct 13, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a heat dissipation device comprising a heat dissipation base and an upper lid. The heat dissipation base is integrally formed by a metal material with superior heat conductivity, and has an airflow channel and an accommodating space. The upper lid covers the accommodating space. The airflow channel communicates with the accommodating space, and the airflow channel has an outlet on one side thereof and a plurality of heat dissipation fins in the interior thereof. The accommodating space has a blade set in the interior thereof, which speeds the dissipation of the heat by forcing the airflow. The advantages of the heat dissipation device of the present invention are to be assembled easily; no noise and turbulent flow; and its application type and occasion are not limited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.