Inkjet-fabricated integrated circuits
US7176040B2 · kind B2 · utility
26Cited by
17References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2002 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Jun 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K77/10
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for forming an integrated circuit including at least two interconnected electronic switching devices, the method comprising forming at least part of the electronic switching devices by ink-jet printing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.