B-stageable die attach adhesives
US7176044B2 · kind B2 · utility
45Cited by
22References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2003 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Aug 9, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.