High density 3-D integrated circuit package
US7176063B2 · kind B2 · utility
1Cited by
33References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2005 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Dec 31, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fill the slotted file.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.