Soldering method and solder joint member
US7176388B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 19, 2004 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Nov 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.