Method for laser-cutting structural components to be joined
US7176408B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 7, 2002 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Mar 21, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a method for cutting structural components to be joined by laser radiation that is guided by a computer-controlled manipulation system provided with a nominal path for each structural component corresponding to a joining line that is curved as a result of at least one of the structural components being three-dimensionally shaped, the structural component surfaces of the structural components including the joining line are determined measuring technologically. Based on measuring results, the nominal path corresponding to a penetration line of the structural components to be joined is calculated. A marking is formed on a first one of the structural component surfaces. When performing the cut on the structural component surface provided with the marking, the resulting cutting gap and the marking are determining measuring technologically. When a deviation of the cutting gap from the nominal path is detected, the manipulation system is controlled to correct the deviation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.