Integrated circuit package with a balanced-part structure
US7176559B2 · kind B2 · utility
111Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2003 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Aug 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package includes a balanced-part structure. The condition of thermal stress of chips connected on a substrate decides the amount, locations, weights, and the material of at least a balanced-part fastened on a substrate. The balanced-part is fastened on the substrate to balance stress distribution before an adhering heat sinks process and a packaging molding compound process. The balanced-part also decreases thermal stress affection and avoid warpage defects of the integrated circuit packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.