Electronically grounded heat spreader
US7176563B2 · kind B2 · utility
2Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2003 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Nov 11, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronically grounded heat spreaders are employed in connection with the dissipation of heat, which is generated by electronic devices, such as semiconductor chips. Also provided is a novel method for the adhesive fastening of metallic heat spreaders to semiconductor chips through the combined use of electrically conductive and non-conductive adhesive materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.