Method for processing a thin film substrate
US7176578B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2005 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Oct 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention comprises a processed thin film substrate (10) and a method therefore, in order to produce a flexible printed circuit card, having a plurality of microvias going or passing through the thin film substrate and electrically connected along faced-away surfaces, in order to form an electric circuit. A first a number of real nano-tracks are filled with a first material (M1), having good electric properties, for the formation of a first number of, here denominated, first vias (V10, V30, V 50), that a second number of real nano-tracks are filled with a second material (M2), having good electric properties, for the formation of a second number of, here denominated, second vias (V20, V40, V60). The first material (M1) and the second material (M2) of said first and second vias (V10–V60) are chosen having mutually different thermoelectric properties. A material surface-applied to the thin film substrate, coated on both sides (10a, 10b) of the thin film substrate (10), is distributed and/or adapted in order to allow the electrical interconnection of first vias, allocated the first material (M1), with second vias, allocated the second material (M2), and that a first via (V…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.