Packaging structure of electronic card
US7177159B2 · kind B2 · utility
3Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2005 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Mar 31, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07732
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A packaging structure of an electronic card includes a metal cover, a plastic frame and a printed circuit board. The metal cover is produced by providing a metal plate having a central portion and an edge portion and performing a draft operation on the metal plate such that the edge portion is vertical to the central portion. The plastic frame has a first surface combined with the metal cover. The printed circuit board is combined with a second surface of the plastic frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.