Method of manufacturing an optoelectronic package
US7178235B2 · kind B2 · utility
7Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2003 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Jan 30, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1023
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.