Diamond saw blade for milling
US7178517B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Jan 31, 2006 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Jan 31, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D1/041
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a diamond saw blade for milling. The rim of the circular metal with a shaft or the front end of the tubular body or an edge of the strip metal has multiple equidistant openings for positioning the diamond grains. The width of the opening is slightly wider or equal to the diameter of the diamond grain. After the diamond grains are positioned in each opening, the metal surface on both sides of each opening is pressed by the jig through two directions. The metal surface on both sides of the opening is deformed by the pressure from the jig, and extrudes along the direction of each opening for bonding diamond grains. Further, the surface forms a rugged cutting edge. More, a diamond layer with diamond grains is electroplated on the surface of the cutting edge. It, therefore, has a long lifecycle and becomes a high-speed cutting edge for milling without deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.