Infrared sensor package
US7180064B2 · kind B2 · utility
3Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2004 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Feb 17, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0118
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An optical sensor package with a substrate that supports a membrane carrying an optical sensor and through which radiation passes to impinge the sensor. The substrate has a first surface in which a cavity is defined, a second surface opposite the first surface, and a wall between the cavity and the second surface. The optical sensor is supported on the membrane, which is bonded to the substrate and spans the cavity in the substrate. A window is defined at the second surface of the substrate for enabling infrared radiation to pass through the wall of the substrate to the optical sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.