Circuits, multi-layer circuits, and methods of manufacture thereof
US7180172B2 · kind B2 · utility
24Cited by
27References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2004 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Jun 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0212
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dielectric material for use in a circuit material comprises a liquid crystalline polymer and a polyhedral oligomeric silsesquioxane (POSS) filler. Such dielectric materials may provide a variety of advantageous properties, especially in high frequency circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.