Nanotube modified solder thermal intermediate structure, systems, and methods
US7180174B2 · kind B2 · utility
17Cited by
12References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 30, 2003 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Sep 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.