Semiconductor device mounting method, semiconductor device mounting structure, electro-optical device, electro-optical device manufacturing method and electronic device
US7180196B2 · kind B2 · utility
1Cited by
8References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2003 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Aug 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring terminal is formed on a wiring substrate, and an electrode is formed on a semiconductor device. The width of the wiring terminal is smaller than the width of the electrode. When the semiconductor device is mounted on the wiring substrate, the wiring terminal becomes embedded in the electrode due to applied pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.