Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
US7180197B2 · kind B2 · utility
30Cited by
10References
50Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2004 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Sep 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a semiconductor device having a structure that can be mounted on a wiring substrate, as for the semiconductor device formed over a thin film-thickness substrate, a film-shaped substrate, or a sheet-like substrate. In addition, the present invention provides a method for manufacturing a semiconductor device that is capable of raising a reliability of mounting on a wiring substrate. One feature of the present invention is to bond a semiconductor element formed on a substrate having isolation to a member that a conductive film is formed via a medium having an anisotropic conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.