Machine vision system for measuring heights of items
US7180606B2 · kind B2 · utility
3Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2004 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Sep 6, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30152
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A machine vision system (1) has two laser sources (2, 3) to illuminate a solder deposit from both sides for comprehensive coverage without occlusion. The camera (4) has an FGPA (32) programmed to define a subset of the sensor array (20) as a region of interest to be processed for each laser source (2, 3). This reduces the amount of data transfer and processing required. The image line (31) is dynamically maintained in the region of interest by adjustement of camara Z position according to warp of the substrate (S).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.