Patent · US Expired

Interface link layer device to build a distributed network

US7180904B2 · kind B2 · utility

2Cited by

20References

13Claims

0Family size

Assignee

Sony Deutschland GmbH · DE

Inventors

Gralf Gaedeken · Burgwedel, DE
Peter Buchner · Kirchheim unter Teck, DE
Gerd Spalink · Stuttgart, DE

Key dates

Filing date	Dec 29, 2000
Grant date	Feb 20, 2007
Priority date	—
Expiry date	Sep 20, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH04L12/40117
WIPO fieldDigital communication
WIPO sectorElectrical engineering

Abstract

An interface link layer device of an interface which allows the interconnection of different networks to build a distributed network, The interface link layer routes complete data packets directly to another interface link layer device that serves the destination via uplink to accept a data packet from a first data bus that has a predetermined destination on a second data bus and to transmit the data packet via a transmission path to interface link layer device. The interface link layer also using downlink to output data packets received via the transmission path from another interface link layer device to a predetermined destination on the first data bus. Further, the interface link layer device is configured such that not all packets have to be transmitted via the interface on basis of an appropriate acknowledge code and response packet generation included in the interface link layer device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.