Method and apparatus for material processing

US7180920B2 · kind B2 · utility

Assignee

• LOMA LINDA UNIVERSITY MEDICAL CENTER · US

Inventors

• Paul E. Denney · Columbus, US
• Jay R. Eastman · Westerville, US
• Paul M. Fallara · Columbus, US
• Andrew P. Joseph · Johnstown, US
• John S. Phillips · Purchase, US
• Ta-Chieh Huang · Dublin, US
• Michael N. Patena · Pataskala, US
• Tim Burnham · Reynoldsburg, US
• Paul Coleman · Minneapolis, US

Key dates

• Filing date: Mar 18, 2004
• Grant date: Feb 20, 2007
• Expiry date: Mar 18, 2024

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/1464
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

An apparatus processes a surface of an inhabitable structure. The apparatus includes a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit includes a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the laser head. The apparatus further includes a controller electrically coupled to the laser base unit. The controller is adapted to transmit control signals to the laser base unit in response to user input.