Fiber optic module packaging architecture for integrated circuit and optical subassembly integration
US7181099B2 · kind B2 · utility
1Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2004 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Apr 5, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4201
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.