Method for dynamically aligning substrates bearing printed reference marks and codes for automated cutting or scoring, and substrates so cut or scored
US7182007B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2004 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Jan 6, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/543
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate to be cut and/or scored is pre-printed with graphics, at least first and second registration marks, and optional encoded-to-print instructions, bar-encoded data, as well as ordinary graphics. The registration marks are sensed as the substrate is automatically transported to a cutting table station that defines a cutting reference plane. Sensed detection of location of the registration marks relative to the reference plane enable the cutting plan for the substrate to be amended for precise location of the graphics on the substrate relative to the reference plane. Automated cutting according to the amended cutting plan occurs. As the registration marks were printed simultaneously with and in known relationship to the graphics, the cut line will be precise relative to the graphics. Machine readable encoded-to-print instructions optionally printed on the substrate can further amend the cutting plan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.