Method of bonding adherend
US7182833B2 · kind B2 · utility
5Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2001 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Jan 24, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
By using a high viscosity moisture-curable adhesive composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated hydrocarbon polymer, (C) a copolymer of which molecular chain is substantially made of one or more alkyl (meth)acrylate monomer unit(s) and (D) an epoxy resin, it becomes possible to bond an adherend to a substrate without open time and without temporary tacking after application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.