Rotating sputtering magnetron
US7182843B2 · kind B2 · utility
3Cited by
8References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2004 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Nov 3, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The magnet arrangement and resulting rotating sputtering magnetron design of an embodiment provides magnetic flux density and distribution to penetrate thick production ferrous targets. Further, the magnetic field shape improves target life by more uniformly removing target material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.