Injection molded metal bonding tray for integrated circuit device fabrication
US7183140B2 · kind B2 · utility
7Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2004 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Nov 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is placed on the substrate and the conductors are bonded to the substrate in an infrared reflow oven, for example. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.