Patent · US Expired

High reverse voltage silicon carbide diode and method of manufacturing the same high reverse voltage silicon carbide diode

US7183575B2 · kind B2 · utility

21Cited by
7References
41Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 19, 2003
Grant dateFeb 27, 2007
Priority date
Expiry dateFeb 19, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D62/8325

Abstract

A high reverse voltage diode includes a hetero junction made up from a silicon carbide base layer, which constitutes a first semiconductor base layer, and a polycrystalline silicon layer, which constitutes a second semiconductor layer, and whose band gap is different from that of the silicon carbide base layer. A low concentration N type polycrystalline silicon layer is deposited on a first main surface side of the silicon carbide base layer, and a metal electrode is formed on a second main surface side of the silicon carbide base layer which is opposite to the first main surface side thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.