Soil probe device and method of making same
US7183779B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 28, 2004 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Dec 28, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/246
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device for measuring one or more different properties of soil or a soil-related substance is provided. The device includes a probe that is inserted into the soil or soil-related substance. The probe includes a tip. The tip is electrically insulative and defines apertures. Electrodes are fitted into the apertures. The tip and electrodes are machined together to have a desired shape that is suitable for insertion into a sample. A printed circuit board (“PCB”) is located inside the probe. The electrodes are soldered directly to the PCB in one embodiment. A temperature sensing element is also located in the tip, near the electrodes, and is connected electrically to the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.