Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
US7184269B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2004 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | May 13, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines a primary coolant flow path and a separate, secondary coolant flow path. The primary coolant flow path includes first and second chambers in fluid communication, and the secondary flow path includes a third chamber disposed between the first and second chambers. The heat exchange assembly provides a first thermal conduction path between primary coolant in the first chamber and secondary coolant in the third chamber, and a second thermal conduction path between primary coolant in the second chamber and secondary coolant in the third chamber. The heat exchange assembly further includes coolant nozzles to direct primary coolant towards the electronics devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.