Heat sink vacuum packaging procedure
US7185434B2 · kind B2 · utility
0Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2004 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Oct 27, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49993
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A heat sink vacuum packaging procedure to rapidly complete the packaging of a heat sink without drilling, pipe welding, vacuum pumping, or other processes. Because the packaging procedure saves much time and labor, the manufacturing cost of the heat sink is relatively reduced. During packaging, no welding process is employed, therefore the invention prevents accidentally flowing of tin solder into the inside of the heat sink to affect the quality of the heat sink, and the quality of the heat sink is maintained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.