Method of creating solder bar connections on electronic packages
US7185799B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2004 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Jul 27, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Solder connections are created between the substrate of an electronic package and a circuit board having lengths that are longer than the width. The solder connections are created by locating solder balls of power or ground connections close enough to one another so that, upon reflow to the circuit board the solder balls combine, creating a larger solder connection. Signal solder balls, however, remain separated. The power or ground solder balls on a particular bond pad are separated from one another by portions of a removable solder mask that keep the solder balls spherical in shape during solder ball attachment to the electronic package. However, it is removed prior to reflow to the circuit board, thus creating a larger, longer solder connection between the electronic package and circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.