Guide and power delivery module
US7186121B1 · kind B1 · utility
31Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2005 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Oct 14, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/187
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A guide module for connecting a first circuit board and a second circuit board and delivering power between the first and second circuit boards is provided. The guide module includes a guide module housing configured to be mechanically mounted to the first circuit board. A power contact is held in the guide module housing. The power contact is configured to convey current between the first and second circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.