Fiber embedded polishing pad
US7186166B2 · kind B2 · utility
6Cited by
19References
5Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 14, 2005 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Nov 14, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.