Patent · US Expired

Adhesive which hardens in several stages

US7186312B1 · kind B1 · utility

7Cited by

8References

20Claims

0Family size

Assignee

Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

Gerd Bolte · Monheim, DE
Andreas Ferencz · Goldkronach, DE
Markus Kruedenscheidt · Langenfeld, DE
Thomas Offergeld · Goldkronach, DE

Key dates

Filing date	Jun 12, 1999
Grant date	Mar 6, 2007
Priority date	—
Expiry date	Jun 12, 2019

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08G2170/20
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A hotmelt adhesive having a melting point of at least 40° C. is provided which may be hardened in multiple stages and which is useful in the production of laminates. The hotmelt adhesive may contain a polymer with at least one functional group that is reactive towards a compound with an acidic hydrogen atom and with one functional group that can be polymerized by UV or electron beams, or a polymer with at least one functional group that is reactive towards a compound with an acidic hydrogen atom and with no functional group that can be polymerized by UV or electron beams. These polymers may be used in combination with a relatively low molecular compound with a functional group that can be polymerized by UV or electron beams.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.