Microfluidic systems with embedded materials and structures and method thereof
US7186352B2 · kind B2 · utility
20Cited by
2References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2004 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Nov 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49114
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Described herein is a process for fabricating microfluidic systems with embedded components in which micron-scale features are molded into the polymeric material polydimethylsiloxane (PDMS). Micromachining is used to create a mold master and the liquid precursors for PDMS are poured over the mold and allowed to cure. The PDMS is then removed form the mold and bonded to another material such as PDMS, glass, or silicon after a simple surface preparation step to form sealed microchannels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.