Constrained layer damper
US7186442B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2003 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Jul 5, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A method for installing a constrained layer damper on a product of manufacture is disclosed. The method includes applying a layer of first polymeric material to a substrate of the product, wherein the first polymeric material is visco-elastic when solidified. Then, a second layer of polymeric material, which is stiff when solidified, is applied to the first polymeric material such that said first polymeric material is constrained between the second polymeric material and the substrate of the product. At least one of the layers of polymeric materials is dispensed in fluid form during the manufacture of the product from a bulk source of fluid material. The polymeric materials are chosen such that they do not require the application of heat above room temperature to solidify.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.