Self-installing heat sink
US7187552B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2005 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | May 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly may include a heat sink that couples with a surface a circuit module installed on the circuit board. The heat sink may automatically couple to the surface of the circuit module when the circuit module is installed on the circuit board. The heat sink may include a thermal interface element that contacts the surface of the circuit module. A biasing element may be coupled between the body and the base to urge a body of the heat sink into contact with the circuit module when the circuit module is installed on the circuit board. In some embodiments, a heat sink may automatically couple with the circuit module when a locking member for the circuit module is actuated to a closed position. In some embodiments, a heat sink may automatically couple with a circuit module when an ejector for the circuit module is actuated. In some embodiments, a heat sink may include an ejector and a locking member for a circuit module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.