Apparatus for cooling semiconductor devices attached to a printed circuit board
US7187553B2 · kind B2 · utility
17Cited by
12References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 9, 2004 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Apr 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly includes a semiconductor device mounted on a printed circuit board, a leaf spring and a cooling plate. A plurality of fasteners pass through co-axial apertures of the leaf spring, the printed circuit board and the cooling plate, such that a contact surface of the leaf spring imparts a force on the semiconductor device to retain the semiconductor device in a thermally conductive position with respect to the cooling plate. A positive cooling effect is achieved regardless of mounting conditions including orientation of the electronic assembly, and the position of the semiconductor device on the cooling plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.