Fluid ejection head assembly
US7188925B2 · kind B2 · utility
3Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2004 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Nov 21, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.