Semiconductor laser module having a co-axial package and transmission lines for complementary driving signal
US7189012B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2004 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Dec 11, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0683
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a semiconductor laser module in which parasitic inductance due to the bonding wire is removed, accordingly, the high frequency performance thereof can be enhanced. The laser module of the present invention has a sub-mount, on which the semiconductor laser diode is installed and transmission lines for supplying the signal to the laser diode is formed. The transmission lines on the sub-mount are directly connected to corresponding lead pins provided in the base of the package without any bonding wires. Between the lead pins and under the sub-mount is provided a photo diode for monitoring light emitted from the laser diode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.