Method of retaining a solder mass on an article
US7189083B2 · kind B2 · utility
13Cited by
14References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2003 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Apr 1, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.