System and method for improved material processing using a laser beam
US7189224B2 · kind B2 · utility
7Cited by
15References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2005 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Aug 25, 2025 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2009/00897
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method and system for improved material processing using a laser beam. The method and system includes directing a laser beam above, at or below the surface of the material in one or more preferred patterns and with preferred laser pulse characteristics specific to the material to reduce or mitigate the accumulation or effects of gas, debris, fluid, or other by-products of photodisruption either at the location where additional laser pulses are being placed or in other sensitive locations in the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.