Etchant, method for roughening copper surface and method for producing printed wiring board
US7189336B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2003 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Jun 2, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An etchant and a method for roughening a copper surface each capable of permitting copper with roughened surface which exhibits acid resistance and permits a copper conductive pattern and an outer layer material to be firmly bonded to each other therethrough in manufacturing of a printed wiring board to simplify the manufacturing. The etchant may contain an oxo acid such as sulfuric acid, peroxide such as hydrogen peroxide and an auxiliary component such as an azole and chlorine. The azole may comprise benzotriazole (BTA). The chlorine may be in the form of sodium chloride (NaCl). The etchant permits a copper surface to be roughened in an acicular manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.