Mobile plating system and method
US7189437B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2003 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Jan 6, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/32
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An exemplary method for using a mobile plating system is provided that includes locating the mobile plating system at a desired location for plating, positioning an external vacuum pump from an interior position of a mobile storage volume of the mobile plasma plating system to an exterior position, and coupling the external vacuum pump to a vacuum chamber within the mobile storage volume of the mobile plasma plating system using a flexible piping segment, rigid coupling with a dampening effect, or other arrangement operable to reduce and/or eliminate the mechanical vibrations within the vacuum chamber due to the operation of the external vacuum pump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.