Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument
US7189598B2 · kind B2 · utility
1Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2004 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Jul 28, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A receiving layer is formed from a thermosetting resin precursor. An interconnecting layer is formed on the receiving layer from a dispersion liquid containing conductive particles. Heat is applied to the receiving layer and the interconnecting layer to cure the thermosetting resin precursor and to bond the conductive particles together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.