Patent · US Expired

Semiconductor device and method for manufacturing the same

US7189997B2 · kind B2 · utility

34Cited by
46References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 26, 2002
Grant dateMar 13, 2007
Priority date
Expiry dateMar 26, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D86/441

Abstract

A semiconductor device, comprises a first electrode, a semiconductor film, a first insulating film and a second insulating film formed between the semiconductor film and the first electrode, a second electrode, and a third insulating film formed between the semiconductor film and the second electrode. The semiconductor film is formed on a flat surface of the second insulating film. A cross portion where the first electrode and the second electrode cross the semiconductor film at the same position is formed. The first electrode and the second electrode are connected to each other through an opening made in the first insulating film and the second insulating film outside the cross portion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.