Thermally enhanced component interposer: finger and net structures
US7190056B2 · kind B2 · utility
5Cited by
4References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2004 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Aug 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC package dissipates thermal energy using thermally and electrically conductive thermal fingers. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive thermal fingers encompass the die pad area to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.