Method and system of tape automated bonding
US7190069B2 · kind B2 · utility
3Cited by
10References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2001 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Jun 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.