Exposure apparatus
US7190432B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2005 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Nov 10, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70425
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a wafer exposure apparatus used in a semiconductor device manufacturing process, the exposure apparatus including: a reflective mirror for reflecting light provided from a light source; an optical path changer for changing a path of the light provided from the reflective mirror; first mirrors installed at both sides of the optical path changer to change the path of the light; second mirrors installed at both sides of a material to change the path of the light; and third mirrors installed at both sides of a mask to enter the light reflected by the first mirrors to the mask and to enter the light passed through the mask into the second mirrors, whereby it is possible to continuously expose one surface, both surfaces or a specific surface of a wafer in a state that the wafer is once aligned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.