Patent · US Expired

Heat sink retention assembly and related methods

US7190586B2 · kind B2 · utility

20Cited by
5References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 3, 2004
Grant dateMar 13, 2007
Priority date
Expiry dateNov 22, 2024

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T24/44026
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Heat sink retention assemblies and related methods are described. In one embodiment, a system comprises a base, a handle rotatably mounted on the base, and heat sink retention structure joined with the handle and moveable by the handle between an opened and a closed position effective to secure a heat sink on a substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.