Electronic control enclosure
US7190589B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2004 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Apr 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20854
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.